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elitra GmbH Bielefeld - News details

Our production partner invests

Expansion of the production facilities

We invest and keep moving.

With the latest investments - the SMD pick-and-place system Europlacer/iineo2 and the new soldering system Go Reflow 2.3 - we are extending our production efficiency and product quality for you on and on.

New soldering system Go Reflow 2.3

New soldering system Go Reflow 2.3

With a heating zone length of 2350 mm the convection reflow soldering system Go Reflow 2.3 is ideally suited for small to medium-sized production series. Besides the attractive design the soldering system convinces above all with its well-engineered concept and excellent soldering results. With seven heat zones and an average working speed of 0.55 to 0.70 m/min. the system provides maximum flexibility in temperature profiling, particularly for lead-free soldering processes. All the components will be safely soldered whereas the temperature impact on the components is reduced significantly. For cooling of the assemblies after the reflow process a fan cooling unit circulating ambient air is used. Horizontal slot nozzles ensure a directed air flow and thus an effective cooling of the boards. Moreover the Go Reflow 2.3 is provided with an up-to-date control unit for easy programming and can be integrated into a fully automated production line.

New SMD pick-and-place system Europlacer / iineo2

New SMD pick-and-place system Europlacer / iineo2

Our new, already second SMD pick-and-place system „Europlacer / iineo2 has two rotary turret heads with 12 placement nozzles and places according to IPC 24,200 components in one hour. The high number of intelligent feeders provides the possibility to place very complex PCBs with a high component variance or also with very different component dimensions. The placing of components with a pin distance of 0.3 mm at QFP and 0.4 mm at µBGA, but also component sizes from 01005 up to 50 x 50 mm are easily possible.

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